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DFLU1400
Document number: DS30784 Rev. 3 - 2
2 of 5
www.diodes.com
June 2013
? Diodes Incorporated
DFLU1400
Maximum Ratings
(@TA
= +25°C, unless otherwise specified.)
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 9)
VRRM
VRWM
VR
400
V
RMS Reverse Voltage
VR(RMS)
280
V
Average Rectified Output Current
IO
1.0
A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
IFSM
30
A
Thermal Characteristics
Characteristic
Symbol
Typ
Max
Unit
Power Dissipation (Note 5) @TA
= +25°C P
D
?
1.0 W
Thermal Resistance Junction to Ambient (Note 5) @TA
= +25°C
RΘJA
117
?
°C/W
Thermal Resistance Junction to Soldering Point (Note 7)
RΘJS
?
6 °C/W
Operating and Storage Temperature Range
Tj, TSTG
-65 to +150
?C
Electrical Characteristics
(@TA
= +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Maximum Forward Voltage Drop @IF
= 1.0A
VFM
1.25
V
Peak Reverse Current @TA
= +25
?C
at Rated DC Blocking Voltage (Note 9)
@TA
= +100
?C
IRM
5.0
200
?A
Maximum Reverse Recovery Time (Note 8)
trr
25
ns
Typical Total Capacitance (f = 1MHz, VR
= 4VDC)
CT
14
pF
Notes: 5. Device mounted on 1" x 1", Polymide PCB; 2 oz. Cu
pad layout as shown on Diodes
Inc. suggested pad layout document AP02001.pdf.
6. RoHS revision 13.2.2003.
Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7.
7. Theoretical R
?JS
calculated from the top center
of the die straight down to the PCB cathode tab solder junction.
8. Measured with I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A. See figure 5.
9. Short duration pulse test used to minimize self-heating effect.
10. Device mounted
on FR-4 PCB, 2oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf. (see page 2)
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